Browsing by author Burghartz, J. N. Subscribe author statistics Burghartz, J. N.

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:  

Showing results 1 to 20 of 20.
Issue DateTitleAuthor(s)TypeAccess
Nov-2002Analysis of chip-size antennas on lossy substrates for short-range wireless micro systemsMendes, P. M.; Correia, J. H.; Bartek, M., et al.Conference paperOpen access
Oct-2004Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passivesBartek, M.; Polyakov, A.; Sinaga, S. M., et al.Conference paperOpen access
Jun-2003Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystemsMendes, P. M.; Bartek, M.; Burghartz, J. N., et al.Conference paperOpen access
Jun-2003Design and tolerance analysis of a 5.7 GHz chip-size microstrip antenna on high resistivity siliconMendes, P. M.; Bartek, M.; Burghartz, J. N., et al.Conference paperOpen access
Oct-2003Design of a folded-patch chip-size antenna for short-range communicationsMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
Jun-2003Extraction of glass-wafers electrical properties based on S-parameters measurements of coplanar waveguidesMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
Nov-2003Folded-patch chip-size antennas for wireless microsystemsMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
Nov-2003Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packagingMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
20-Jan-2005High-resistivity polycrystalline silicon as RF substrate in wafer-level packagingPolyakov, A.; Sinaga, S. M.; Mendes, P. M., et al.ArticleOpen access
Jun-2003Integrated 5.7 GHz chip-size antenna for wireless sensor networksMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
Sep-2003Integrated chip-size antenna for wireless microsystems : fabrication and design considerationsMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
Jan-2006Integrated chip-size antennas for wireless microsystems : fabrication and design ConsiderationsMendes, P. M.; Polyakov, A.; Bartek, M., et al.ArticleOpen access
Oct-2004An integrated folded-patch antenna for wireless microsystemsMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
Oct-2004An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrateMendes, P. M.; Polyakov, A.; Bartek, M., et al.Conference paperOpen access
Sep-2004Novel very small dual-band chip-size antenna for wireless sensor networksMendes, P. M.; Bartek, M.; Burghartz, J. N., et al.Conference paperOpen access
May-2003Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packagesPolyakov, A.; Mendes, P. M.; Sinaga, S. M., et al.Conference paperOpen access
Oct-2004Size reduction and tuning of integrated folded patch antennas using slotsMendes, P. M.; Bartek, M.; Burghartz, J. N., et al.Conference paperOpen access
Sep-2004Wafer-level chip-scale packaging for low-end RF productsBartek, M.; Zilmer, G.; Teomin, D., et al.Conference paperOpen access
Jun-2004Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technologyMendes, P. M.; Sinaga, S. M.; Polyakov, A., et al.Conference paperOpen access
14-Nov-2004Wafer-level packaging fo RF applications : using high resistivity polycrystalline silicon substrate technologyPolyakov, A.; Sinaga, S. M.; Mendes, P. M., et al.Conference paperOpen access