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TitleProcessability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages
Author(s)Polyakov, A.
Mendes, P. M.
Sinaga, S. M.
Bartek, M.
Rejaei, B.
Correia, J. H.
Burghartz, J. N.
KeywordsWafer level packaging
Wafer bonding
Glass wafer processing
Issue dateMay-2003
JournalProceedings - Electronic Components and Technology Conference
CitationELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 53, New Orleans, 2003 - "Proceedings". New Orleans : IEEE, 2003. ISBN 0-7803-7430-4. p. 875-880.
Abstract(s)Various types of glass substrates have been compared with respect to their suitability as a low-loss substrate in wafer-level chip-scale packaging for RF applications. Processability has been evaluated by fabrication of shallow and deep recesses using wet etching in HF (/H3PO4) solutions. Electrical characteristics (dielectric constant and attenuation) have been extracted from measurements on coplanar wave guides (CPWs) up to 10 GHz. Results show that Coming Pyrex #7740 glass provides optical quality of wet-etched deep recesses, but exhibit about 2 times higher electrical attenuation than Hoya SD-2. Pyrex #7740 and SD-2 are thermally matched to silicon and due to some alkali content, they are suitable for anodic bonding. The relatively high content of AL2O3 (~20%) in SD-2 is favorable for its electrical properties, but makes wet etching of deep recesses more difficult. The non-alkaline AF45, with CTE almost 2 times of Si (CTEAF45=4.5x10-6 k-1), is suitable for adhesive bonding and is difficult to pattern using wet etching. Its electrical attenuation is close to that of SD-2. The measured dielectric constants (at 6 GHz) for SD-2, Pyrex #7740 and AF45 are 4.7,5.9 and 6.1, respectively.
TypeConference paper
AccessOpen access
Appears in Collections:DEI - Artigos em atas de congressos internacionais

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