Please use this identifier to cite or link to this item: https://hdl.handle.net/1822/5939

TitleIntegrated chip-size antennas for wireless microsystems : fabrication and design Considerations
Author(s)Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
KeywordsChip-size antenna
Wireless microsystem
Wafer-level packaging
Excimer laser ablation
Via fabrication
water-level packaging
wireless inicrosystein
Issue dateJan-2006
PublisherElsevier
JournalSensors and Actuators A: Physical
Citation"Sensors and actuators A physical". ISSN 0924-4247. 125:2 (Jan. 2006) 217-222.
Abstract(s)This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved.
TypeArticle
URIhttps://hdl.handle.net/1822/5939
DOI10.1016/j.sna.2005.07.016
ISSN0924-4247
Publisher versionhttp://www.sciencedirect.com/science?_ob=MImg&_imagekey=B6THG-4H5DY92-2-N&_cdi=5282&_user=2459786&_orig=browse&_coverDate=01%2F10%2F2006&_sk=998749997&view=c&wchp=dGLzVlz-zSkWz&md5=dca8e5efa46176e12057c3da92f80c97&ie=/sdarticle.pdf
Peer-Reviewedyes
AccessOpen access
Appears in Collections:DEI - Artigos em revistas internacionais

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