Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/1549
Título: | Design of a folded-patch chip-size antenna for short-range communications |
Autor(es): | Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
Palavras-chave: | Antenna design Small antennas Wafer level packaging Folded patch antenna |
Data: | Out-2003 |
Editora: | Horizon House |
Citação: | European Microwave Conference, 33, Munich, 2003 - "European microwave conference". [S.l.] : Horizon House, 2003. ISBN 1-58053-839-8. p. 723-726. |
Resumo(s): | We report on design of an integrated folded shorted-patch (FSP) chip-size antenna for operation at 5.7 GHz and use in short-range wireless communications. Application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows antenna on-chip integration. The operating characteristics of a folded S-P antenna built on two stacked glass substrates were analysed with respect to substrate thickness, middle patch length and substrate sidewall angles. Antenna size reduction down to 4x4x1 mm3, efficiency of 66% and bandwidth of 62 MHz are predicted. |
Tipo: | Artigo em ata de conferência |
URI: | https://hdl.handle.net/1822/1549 |
ISBN: | 1-58053-839-8 |
Arbitragem científica: | yes |
Acesso: | Acesso aberto |
Aparece nas coleções: | DEI - Artigos em atas de congressos internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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EuMW_2003.pdf | 201,74 kB | Adobe PDF | Ver/Abrir |