Please use this identifier to cite or link to this item:
|Fabrication of flexible thermoelectric microcoolers using planar thin-film technologies
|Gonçalves, L. M.
Rocha, J. G.
Rowe, D. M.
Correia, J. H.
|IOP Publishing Ltd
|Journal of Micromechanics and Microengineering
|"Journal of Micromechanics and Microengineering". ISSN 0960-1316. 17:7 (July 2007) S168-S173.
|The present work reports on the fabrication and characterization of a planar Peltier cooler on a flexible substrate. The device was fabricated on a 12 νm thick Kapton(c) polyimide substrate using Bi2Te3 and Sb2Te3 thermoelectric elements deposited by thermal co-evaporation. The cold area of the device is cooled with four thermoelectric junctions, connected in series using metal contacts. Plastic substrates add uncommon mechanical properties to the composite film-substrate and enable integration with novel types of flexible electronic devices. Films were deposited by co-evaporation of tellurium and bismuth or antimony to obtain Bi2Te3 or Sb2Te3, respectively. Patterning of the thermoelectric materials using lift-off and wet-etching techniques was studied and compared. The performance of the Peltier microcooler was analysed by infrared image microscopy, on still-air and under vacuum conditions, and a maximum temperature difference of 5 °C was measured between the cold and the hot sides of the device. © 2007 IOP Publishing Ltd.
|Appears in Collections:
|DEI - Artigos em revistas internacionais
Files in This Item:
|Paper JMM MME06 published.pdf