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https://hdl.handle.net/1822/8640
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Campo DC | Valor | Idioma |
---|---|---|
dc.contributor.author | Gonçalves, L. M. | - |
dc.contributor.author | Rocha, J. G. | - |
dc.contributor.author | Couto, Carlos | - |
dc.contributor.author | Alpuim, P. | - |
dc.contributor.author | Min, Gao | - |
dc.contributor.author | Rowe, D. M. | - |
dc.contributor.author | Correia, J. H. | - |
dc.date.accessioned | 2009-01-22T11:38:52Z | - |
dc.date.available | 2009-01-22T11:38:52Z | - |
dc.date.issued | 2007-07 | - |
dc.identifier.citation | "Journal of Micromechanics and Microengineering". ISSN 0960-1316. 17:7 (July 2007) S168-S173. | en |
dc.identifier.issn | 0960-1316 | en |
dc.identifier.uri | https://hdl.handle.net/1822/8640 | - |
dc.description.abstract | The present work reports on the fabrication and characterization of a planar Peltier cooler on a flexible substrate. The device was fabricated on a 12 νm thick Kapton(c) polyimide substrate using Bi2Te3 and Sb2Te3 thermoelectric elements deposited by thermal co-evaporation. The cold area of the device is cooled with four thermoelectric junctions, connected in series using metal contacts. Plastic substrates add uncommon mechanical properties to the composite film-substrate and enable integration with novel types of flexible electronic devices. Films were deposited by co-evaporation of tellurium and bismuth or antimony to obtain Bi2Te3 or Sb2Te3, respectively. Patterning of the thermoelectric materials using lift-off and wet-etching techniques was studied and compared. The performance of the Peltier microcooler was analysed by infrared image microscopy, on still-air and under vacuum conditions, and a maximum temperature difference of 5 °C was measured between the cold and the hot sides of the device. © 2007 IOP Publishing Ltd. | en |
dc.language.iso | eng | en |
dc.publisher | IOP Publishing Ltd | por |
dc.rights | openAccess | en |
dc.subject | Peltier | en |
dc.subject | Flexible | en |
dc.title | Fabrication of flexible thermoelectric microcoolers using planar thin-film technologies | en |
dc.type | article | por |
dc.peerreviewed | yes | en |
dc.relation.publisherversion | www.iop.org | en |
sdum.number | 7 | en |
sdum.pagination | S168-S173 | en |
sdum.publicationstatus | published | en |
sdum.volume | 17 | en |
oaire.citationStartPage | S168 | por |
oaire.citationEndPage | S173 | por |
oaire.citationIssue | 7 | por |
oaire.citationVolume | 17 | por |
dc.identifier.doi | 10.1088/0960-1317/17/7/S14 | por |
dc.subject.wos | Science & Technology | por |
sdum.journal | Journal of Micromechanics and Microengineering | por |
Aparece nas coleções: | DEI - Artigos em revistas internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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Paper JMM MME06 published.pdf | 957,1 kB | Adobe PDF | Ver/Abrir |