Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/21100
Título: | High-aspect-ratio neural electrode array fabrication using thermomigration process |
Autor(es): | Peixoto, A. C. Silva, A. F. Dias, N. S. Correia, J. H. |
Palavras-chave: | Invasive neural electrode Microelectrode array Thermomigration Silicon |
Data: | Set-2012 |
Editora: | Elsevier Science BV |
Revista: | Procedia Engineering |
Resumo(s): | A novel fabrication process for a high-aspect-ratio recording and stimulation intracortical neural microelectrode array is described. Using a combination of dicing and KOH wet-etching, microspikes are formed on the surface of a n-type (100), 4 mm thick, silicon wafer. Deep 3 mm cuts are performed in order to produce sharped tip pillars of high-aspect-ratio (0.2x0.2x3 mm). Thermomigration is employed as a selective doping technique performing electrically insulated pillars due to the pn back biased junctions formed between each pair of n-type substrate and p+ migrated trails. Gold is deposited over the spikes in order to have a good ionic interface with the neural tissue, while the remaining surface is passivated with a biocompatible layer of cyanoacrylate. The final result is a deep penetrating electrode array with potential new applications in neuroprosthetics’ research field. |
Tipo: | Artigo em ata de conferência |
URI: | https://hdl.handle.net/1822/21100 |
DOI: | 10.1016/j.proeng.2012.09.212 |
ISSN: | 1877-7058 |
Versão da editora: | http://www.sciencedirect.com/s |
Arbitragem científica: | yes |
Acesso: | Acesso restrito UMinho |
Aparece nas coleções: | DEI - Artigos em atas de congressos internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
---|---|---|---|---|
High-aspect-ratio neural electrode array fabrication using thermomigration process.pdf Acesso restrito! | Full-article | 248,08 kB | Adobe PDF | Ver/Abrir |