Please use this identifier to cite or link to this item: http://hdl.handle.net/1822/21100

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dc.contributor.authorPeixoto, A. C.-
dc.contributor.authorSilva, A. F.-
dc.contributor.authorDias, N. S.-
dc.contributor.authorCorreia, J. H.-
dc.date.accessioned2012-11-30T17:27:08Z-
dc.date.available2012-11-30T17:27:08Z-
dc.date.issued2012-09-
dc.identifier.issn1877-7058-
dc.identifier.urihttp://hdl.handle.net/1822/21100-
dc.description.abstractA novel fabrication process for a high-aspect-ratio recording and stimulation intracortical neural microelectrode array is described. Using a combination of dicing and KOH wet-etching, microspikes are formed on the surface of a n-type (100), 4 mm thick, silicon wafer. Deep 3 mm cuts are performed in order to produce sharped tip pillars of high-aspect-ratio (0.2x0.2x3 mm). Thermomigration is employed as a selective doping technique performing electrically insulated pillars due to the pn back biased junctions formed between each pair of n-type substrate and p+ migrated trails. Gold is deposited over the spikes in order to have a good ionic interface with the neural tissue, while the remaining surface is passivated with a biocompatible layer of cyanoacrylate. The final result is a deep penetrating electrode array with potential new applications in neuroprosthetics’ research field.por
dc.description.sponsorshipFundação para a Ciência e a Tecnologia (FCT) - FCOMP 01 0124-FEDER-010909, FCT/PTDC/SAU-BEB/100392/2008por
dc.language.isoengpor
dc.publisherElsevier Science BVpor
dc.rightsrestrictedAccesspor
dc.subjectInvasive neural electrodepor
dc.subjectMicroelectrode arraypor
dc.subjectThermomigrationpor
dc.subjectSiliconpor
dc.titleHigh-aspect-ratio neural electrode array fabrication using thermomigration processpor
dc.typeconferencePaperpor
dc.peerreviewedyespor
dc.relation.publisherversionhttp://www.sciencedirect.com/spor
sdum.publicationstatuspublishedpor
oaire.citationStartPage574por
oaire.citationEndPage577por
oaire.citationConferencePlaceKrakow, Polandpor
oaire.citationTitleProcedia Engineeringpor
oaire.citationVolume47por
dc.identifier.doi10.1016/j.proeng.2012.09.212por
dc.subject.wosScience & Technologypor
sdum.journalProcedia Engineeringpor
sdum.conferencePublication26TH EUROPEAN CONFERENCE ON SOLID-STATE TRANSDUCERS, EUROSENSOR 2012por
Appears in Collections:CAlg - Artigos em livros de atas/Papers in proceedings
DEI - Artigos em atas de congressos internacionais

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