Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/21100
Registo completo
Campo DC | Valor | Idioma |
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dc.contributor.author | Peixoto, A. C. | - |
dc.contributor.author | Silva, A. F. | - |
dc.contributor.author | Dias, N. S. | - |
dc.contributor.author | Correia, J. H. | - |
dc.date.accessioned | 2012-11-30T17:27:08Z | - |
dc.date.available | 2012-11-30T17:27:08Z | - |
dc.date.issued | 2012-09 | - |
dc.identifier.issn | 1877-7058 | - |
dc.identifier.uri | https://hdl.handle.net/1822/21100 | - |
dc.description.abstract | A novel fabrication process for a high-aspect-ratio recording and stimulation intracortical neural microelectrode array is described. Using a combination of dicing and KOH wet-etching, microspikes are formed on the surface of a n-type (100), 4 mm thick, silicon wafer. Deep 3 mm cuts are performed in order to produce sharped tip pillars of high-aspect-ratio (0.2x0.2x3 mm). Thermomigration is employed as a selective doping technique performing electrically insulated pillars due to the pn back biased junctions formed between each pair of n-type substrate and p+ migrated trails. Gold is deposited over the spikes in order to have a good ionic interface with the neural tissue, while the remaining surface is passivated with a biocompatible layer of cyanoacrylate. The final result is a deep penetrating electrode array with potential new applications in neuroprosthetics’ research field. | por |
dc.description.sponsorship | Fundação para a Ciência e a Tecnologia (FCT) - FCOMP 01 0124-FEDER-010909, FCT/PTDC/SAU-BEB/100392/2008 | por |
dc.language.iso | eng | por |
dc.publisher | Elsevier Science BV | por |
dc.rights | restrictedAccess | por |
dc.subject | Invasive neural electrode | por |
dc.subject | Microelectrode array | por |
dc.subject | Thermomigration | por |
dc.subject | Silicon | por |
dc.title | High-aspect-ratio neural electrode array fabrication using thermomigration process | por |
dc.type | conferencePaper | por |
dc.peerreviewed | yes | por |
dc.relation.publisherversion | http://www.sciencedirect.com/s | por |
sdum.publicationstatus | published | por |
oaire.citationStartPage | 574 | por |
oaire.citationEndPage | 577 | por |
oaire.citationConferencePlace | Krakow, Poland | por |
oaire.citationTitle | Procedia Engineering | por |
oaire.citationVolume | 47 | por |
dc.identifier.doi | 10.1016/j.proeng.2012.09.212 | por |
dc.subject.wos | Science & Technology | por |
sdum.journal | Procedia Engineering | por |
sdum.conferencePublication | 26TH EUROPEAN CONFERENCE ON SOLID-STATE TRANSDUCERS, EUROSENSOR 2012 | por |
Aparece nas coleções: | DEI - Artigos em atas de congressos internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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High-aspect-ratio neural electrode array fabrication using thermomigration process.pdf Acesso restrito! | Full-article | 248,08 kB | Adobe PDF | Ver/Abrir |