Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/91353
Título: | Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing |
Autor(es): | Gonçalves, Sandra Beatriz Tomé Oliveira, Maria J. Peixoto, Alexandre Coumiotis Moreira Ferreira da Silva, Alexandre Correia, J. H. |
Palavras-chave: | Dicing saw Diamond blade Neural microelectrode array Silicon wafer |
Data: | 2016 |
Editora: | Springer |
Revista: | The International Journal of Advanced Manufacturing Technology |
Citação: | Goncalves, S.B., Oliveira, M.J., Peixoto, A.C. et al. Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing. Int J Adv Manuf Technol 85, 431–442 (2016). https://doi.org/10.1007/s00170-015-7948-7 |
Resumo(s): | This paper describes an optimized out-of-plane fabrication method for neural 3D high-aspect-ratio microelectrode array (MEA) based on a dicing technology platform (a standard procedure in semiconductor industry). The proposed MEA fabrication required important modifications in the dicing process. Since electrodes length reaches up to 4 mm, the main hindrance was the 2 mm cutting depth limit allowed for dicing machines with regular blades. This new procedure consisted on modifying Z-axis calibration, so cuts as deep as the exposure of blades were possible. The employment of proper blades for each fabrication step was also mandatory. Thin and high-exposure blades were used for deep cuts in silicon wafers, and V-shaped blades were employed to produce sharpened tips on the electrodes. Moreover, parameters as very low-cut speeds were essential to avoid wafer chipping and microcracks. Results showed high-precision and high-quality cuts in all steps of the 3D MEA fabrication, without unnecessary additional steps of etching post-processing. The optimized fabrication process was successfully demonstrated with a 3D neural probe array comprising 36 individually addressable electrodes. |
Tipo: | Artigo |
URI: | https://hdl.handle.net/1822/91353 |
DOI: | 10.1007/s00170-015-7948-7 |
ISSN: | 0268-3768 |
Versão da editora: | https://link.springer.com/article/10.1007/s00170-015-7948-7 |
Arbitragem científica: | yes |
Acesso: | Acesso restrito UMinho |
Aparece nas coleções: | DEI - Artigos em revistas internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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10.10072Fs00170-015-7948-7.pdf Acesso restrito! | 17,38 MB | Adobe PDF | Ver/Abrir |