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https://hdl.handle.net/1822/1567| Título: | Integrated 5.7 GHz chip-size antenna for wireless sensor networks |
| Autor(es): | Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
| Palavras-chave: | Integrated antenna Wireless sensor networks Wafer level packaging Antenna measurements Bandwidth Chip scale packaging Fabrication Frequency measurement Gain measurement Patch antennas Wafer bonding Wafer scale integration |
| Data: | Jun-2003 |
| Editora: | IEEE |
| Citação: | TRANSDUCERS ´03. IEEE INTERNATIONAL CONFERENCE ON SOLID STATE SENSORS, ACTUATORS AND MICROSYSTEMS, 12, Boston, 2003 - "Digest of technical papers". Boston : IEEE, 2003. ISBN 0-7803-7731-1. vol. 1. p. 49-52. |
| Resumo(s): | We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%. |
| Tipo: | Artigo em ata de conferência |
| URI: | https://hdl.handle.net/1822/1567 |
| ISBN: | 0-7803-7731-1 |
| DOI: | 10.1109/SENSOR.2003.1215250 |
| Arbitragem científica: | yes |
| Acesso: | Acesso aberto |
| Aparece nas coleções: | DEI - Artigos em atas de congressos internacionais |
Ficheiros deste registo:
| Ficheiro | Descrição | Tamanho | Formato | |
|---|---|---|---|---|
| Transducers.pdf | 269,26 kB | Adobe PDF | Ver/Abrir |
