Utilize este identificador para referenciar este registo: https://hdl.handle.net/1822/61340

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dc.contributor.authorRebouta, L.por
dc.contributor.authorRubio-Peña, L.por
dc.contributor.authorOliveira, C.por
dc.contributor.authorLanceros-Méndez, S.por
dc.contributor.authorTavares, C. J.por
dc.contributor.authorAlves, E.por
dc.date.accessioned2019-09-09T11:24:50Z-
dc.date.available2019-09-09T11:24:50Z-
dc.date.issued2010-06-01-
dc.identifier.issn0040-6090por
dc.identifier.urihttps://hdl.handle.net/1822/61340-
dc.description.abstractTransparent, conducting, indium tin oxide (ITO) films have been deposited, by pulsed dc magnetron sputtering, on glass and electroactive polymer (poly(vinylidene fluoride)-PVDF) substrates. Samples have been prepared at room temperature by varying the oxygen partial pressure. Electrical resistivity around 8.4 x 10(-4) Omega cm has been obtained for films deposited on glass, while a resistivity of 1.7 x 10(-3) Omega cm has been attained in similar coatings on PVDF. Fragmentation tests were performed on PVDF substrates with thicknesses of 28 mu m and 110 mu m coated with 40 nm ITO layer. The coating's fragmentation process was analyzed and the crack onset strain and cohesive strength of ITO layers were evaluated.por
dc.description.sponsorshipThe authors appreciate the funding from the Portuguese Foundation for Science and Technology (FCT) (Grant PTDC/CTM/69316/2006) and INL project 156: SIMBIO.por
dc.language.isoengpor
dc.publisherElsevier Science SApor
dc.relationinfo:eu-repo/grantAgreement/FCT/5876-PPCDTI/69316/PTpor
dc.rightsopenAccesspor
dc.subjectTensile testpor
dc.subjectITOpor
dc.subjectCohesive strengthpor
dc.subjectCrack onset strainpor
dc.subjectElectroactive polymerspor
dc.titleStrain dependence electrical resistance and cohesive strength of ITO thin films deposited on electroactive polymerpor
dc.typearticle-
dc.peerreviewedyespor
oaire.citationStartPage4525por
oaire.citationEndPage4528por
oaire.citationIssue16por
oaire.citationVolume518por
dc.date.updated2019-09-09T10:11:22Z-
dc.identifier.doi10.1016/j.tsf.2009.12.022por
dc.subject.wosScience & Technology-
sdum.export.identifier5398-
sdum.journalThin Solid Filmspor
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