Utilize este identificador para referenciar este registo: https://hdl.handle.net/1822/2458

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Campo DCValorIdioma
dc.contributor.authorSena-Cruz, José-
dc.contributor.authorBarros, Joaquim A. O.-
dc.date.accessioned2005-07-22T15:59:33Z-
dc.date.available2005-07-22T15:59:33Z-
dc.date.issued2004-07-
dc.identifier.citation"Computers and Structures". Amsterdam : Elsevier, ISSN 0045-7949. 82 (2004). p. 1513–1521.eng
dc.identifier.issn0045-7949eng
dc.identifier.urihttps://hdl.handle.net/1822/2458-
dc.description.abstractNear-surface mounted (NSM) laminate strips of carbon fiber reinforced polymer (CFRP) is a promising technique for increasing the flexural and the shear strength of deficient concrete members. Using the results of an experimental program with pullout-bending tests and developing a numerical strategy, an analytical bond stress–slip relationship was obtained. This relationship was converted into a bond stress–slip constitutive law for a line interface finite element, used to simulate the concrete–CFRP bond behavior. The numerical model developed predicted all the significant aspects registered experimentally, and can be used to assess relevant information in the design of concrete structures strengthened by NSM technique.eng
dc.description.sponsorshipFundação para a Ciência e a Tecnologia (FCT) e FSE (SFRH/BD/3259/2000, SFRH/BSAB/291/2002-POCTI)por
dc.language.isoengeng
dc.publisherPergamon-Elsevier Science Ltdpor
dc.rightsopenAccesseng
dc.subjectBondeng
dc.subjectSlipeng
dc.subjectNear-surface mountedeng
dc.subjectCFRP laminate stripeng
dc.subjectEpoxy-adhesiveeng
dc.subjectLine interface elementeng
dc.titleModeling of bond between near-surface mounted CFRP laminate strips and concreteeng
dc.typearticleeng
dc.peerreviewedyeseng
dc.relation.publisherversionwww.elsevier.com/locate/compstruceng
sdum.pagination1513–1521eng
sdum.publicationstatuspublishedeng
sdum.volume82eng
oaire.citationStartPage1513por
oaire.citationEndPage1521por
oaire.citationIssue17-19por
oaire.citationVolume82por
dc.identifier.doi10.1016/j.compstruc.2004.03.047por
dc.subject.wosScience & Technologypor
sdum.journalComputers and Structurespor
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