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TitleSpiral inductors on silicon for wireless communications
Author(s)Trabulo, Pedro
Durães, Dalila
Mendes, P. M.
Garrido, Paulo
Correia, J. H.
KeywordsSilicon spiral inductors
RFIC devices
Bulk-micromachining technology
Issue date2004
PublisherTrans Tech Publications
JournalMaterials Science Forum
CitationMARTINS, Rodrigo [et al.], ed. lit. - "Advanced materials forum II : proceedings of the International Materials Symposium, 2, Costa da Caparica, 2003". Zürich : Trans Tech Publications, 2004. ISBN 0-87849-941-5. vol. 455-456, p. 116-119.
Abstract(s)This paper presents the design and fabrication of integrated micromachined inductors on silicon substrates. In order to reduce eddy currents in silicon substrates, bulk-micromachining technology is used to etch the silicon wafer. In this way, aluminum spiral micromachined inductors can achieve a quality factor Q of approximately 30 (0.6-2 nH @ 2-15 GHz). Also, the resistivity of the inductors material is discussed.
TypeConference paper
AccessOpen access
Appears in Collections:DEI - Artigos em atas de congressos nacionais

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