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dc.contributor.authorDias, N. S.-
dc.contributor.authorCarmo, João Paulo Pereira-
dc.contributor.authorMendes, P. M.-
dc.contributor.authorCorreia, J. H.-
dc.identifier.citation"IEEE Sensors Journal." ISSN 1530-437X. 11:3 (Mar. 2011) 755-762.por
dc.description.abstractThis paper describes a low-power/low-voltage CMOS wireless interface (CMOS-WiI) at 5.7 GHz with dry electrodes for congnitive networks. The electrodes are 4 x 4 microtip arrays and acquire electroencephalogram (EEG) signals in key- points for processing. The CMOS-WiI was fabricated in a UMC 0.18 µm RF CMOS process and its total power consumption is 23mW with a voltage-supply of only 1.5 V. The carrier frequency is digitally selectable and it can be one of 16 possible values in the range 5.42–5.83 GHz, with 27.12 MHz steps. These multiple carriers allow a better spectrum allocation as well as the acquisition, processing and transmission of high-quality EEG signals from 16 electrode arrays. The microtips array was fabricated through bulk micromachining of a <100> -type silicon substrate in a potassium hydroxide solution and avoids long subject preparations for EEG data acquisition. The reactive sputtering of iridium dioxide (IrO) on the surface of the array guarantees its biocompatibility. The fabrication process was trimmed in a way that each microtip presents solid angles of 54.7 , a width in the range 150–200 µm, a height of 100–200 µm, and a microtip interspacing of 2 µm. The microtips array coated with IrO together with the CMOS-WiI permit the remote monitoring of EEG signals from freely-moving subjects.por
dc.subjectSensor interfacepor
dc.subjectWireless microsystemspor
dc.subjectWireless sensors networks.por
dc.titleA low-power/low-voltage CMOS wireless interface at 5.7 GHz with dry electrodes for cognitive networkspor
oaire.citationTitleIEEE Sensors Journalpor
dc.subject.wosScience & Technologypor
sdum.journalIEEE Sensors Journalpor
Appears in Collections:CAlg - Artigos em revistas internacionais / Papers in international journals
DEI - Artigos em revistas internacionais

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