Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/53434
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Campo DC | Valor | Idioma |
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dc.contributor.author | Soares, Delfim | por |
dc.contributor.author | Gonçalves, Cristina Isabel Batista | por |
dc.contributor.author | Leitão, H | por |
dc.contributor.author | Lau, C.S. | por |
dc.contributor.author | Teixeira, J. Carlos | por |
dc.contributor.author | Ribas, José Luis | por |
dc.contributor.author | Teixeira, S. F. C. F. | por |
dc.contributor.author | Cerqueira, M. F. | por |
dc.contributor.author | Macedo, Francisco | por |
dc.date.accessioned | 2018-03-25T22:38:50Z | - |
dc.date.issued | 2015 | - |
dc.identifier.citation | C. Gonçalves, H. Leitão, J. C. Teixeira, L. Ribas, S. Teixeira, M. F. Cerqueira, F. Macedo, D. Soares (2015) Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospheres, Journal of Materials Science: Materials in Electronics, DOI: http://link.springer.com/article/10.1007/s10854-015-3037-9 | por |
dc.identifier.issn | 0957-4522 | por |
dc.identifier.uri | https://hdl.handle.net/1822/53434 | - |
dc.description.abstract | The wettability between solder and substrate is a very important issue in reliability of soldering process. The contact angle h is used to measure the degree of wetting. The contact angle of lead-free alloy Sn-3 % Ag-0.5 % Cu (wt%) was measured, as a function of temperature, for three different commercial surface finish substrates used in printed circuit boards (PCB): Sn, NiAu and Organic Solderability Preservative (OSP). The measurements were performed by the sessile drop method in two different atmospheres: high vacuum and inert gas. In high vacuum the results showed that on substrates of NiAu and OSP the solder started spreading suddenly at 225 C and in Sn substrate the contact angle decreases slightly with temperature. In inert gas atmosphere the results showed different behaviours: the contact angle between molten solder in OSP and NiAu substrates is sensitive to temperature; and, in Sn substrate, the contact angle does not change with temperature. The NiAu and OSP substrates showed a better degree of wettability than Sn substrate, in inert atmosphere. | por |
dc.description.sponsorship | The authors acknowledge the financial support provided through project SI I&DT Projeto em co-promoção No. 36265/2013 (Projeto HMIEXCEL—2013–2015). | - |
dc.language.iso | eng | por |
dc.publisher | Springer | por |
dc.rights | restrictedAccess | por |
dc.title | Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospheres | por |
dc.type | article | por |
dc.peerreviewed | yes | por |
oaire.citationStartPage | 5106 | por |
oaire.citationEndPage | 5112 | por |
oaire.citationIssue | 7 | por |
oaire.citationVolume | 26 | por |
dc.identifier.doi | 10.1007/s10854-015-3037-9 | por |
dc.subject.fos | Engenharia e Tecnologia::Engenharia dos Materiais | por |
dc.description.publicationversion | info:eu-repo/semantics/publishedVersion | por |
dc.subject.wos | Science & Technology | por |
sdum.journal | Journal of Materials Science: Materials in Electronics | por |
Aparece nas coleções: | CAlg - Artigos em revistas internacionais / Papers in international journals DEM - Artigos em revistas de circulação internacional com arbitragem científica |
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art_3A10.1007_2Fs10854-015-3037-9.pdf Acesso restrito! | 640,95 kB | Adobe PDF | Ver/Abrir |