Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/48422
Título: | Relationship between nano-architectured Ti1−xCux thin film and electrical resistivity for resistance temperature detectors |
Autor(es): | Ferreira, Armando José Barros Borges, Joel Nuno Pinto Lopes, C. Rodrigues, M. S. Lanceros-Méndez, S. Vaz, F. |
Data: | Mai-2017 |
Editora: | Springer |
Revista: | Journal of Materials Science |
Citação: | Ferreira, A., Borges, J., Lopes, C. et al. J Mater Sci (2017) 52: 4878. https://doi.org/10.1007/s10853-016-0722-x |
Resumo(s): | Ti1−xCux thin films were produced by the glancing angle deposition technique (GLAD) for resistance temperature measurements. The deposition angle was fixed at α = 0° to growth columnar structures and α = 45° to growth zigzag structures. The Ti-to-Cu atomic concentration was tuned from 0 to 100 at.% of Cu in order to optimize the temperature coefficient of resistance (TCR) value. Increasing the amount of Cu in the Ti1−xCux thin films, the electrical conductivity was gradually changed from 4.35 to 7.87 × 105 Ω−1 m−1. After thermal “stabilization,” the zigzag structures of Ti1−xCux films induce strong variation of the thermosensitive response of the materials and exhibited a reversible resistivity versus temperature between 35 and 200 °C. The results reveal that the microstructure has an evident influence on the overall response of the films, leading to values of TCR of 8.73 × 10−3 °C−1 for pure copper films and of 4.38 × 10−3 °C−1 for a films of composition Ti0.49Cu0.51. These values are very close to the ones reported for the bulk platinum (3.93 × 10−3 °C−1), which is known to be one of the best material available for these kind of temperature-related applications. The non-existence of hysteresis in the electrical response of consecutive heating and cooling steps indicates the viability of these nanostructured zigzag materials to be used as thermosensitive sensors. |
Tipo: | Artigo |
URI: | https://hdl.handle.net/1822/48422 |
DOI: | 10.1007/s10853-016-0722-x |
ISSN: | 0022-2461 |
e-ISSN: | 1573-4803 |
Versão da editora: | https://link.springer.com/article/10.1007/s10853-016-0722-x |
Arbitragem científica: | yes |
Acesso: | Acesso aberto |
Aparece nas coleções: | CDF - FCD - Artigos/Papers (with refereeing) |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
---|---|---|---|---|
Armando Ferreira.pdf | 1,09 MB | Adobe PDF | Ver/Abrir |