Deposition of conductive materials on textile and polymeric flexible substrates

Abstract

This paper describes the study, analysis and selection of textile and similar materials to be used as flexible substrates for thin conductive film deposition, in the context of integrating electronics into textiles. Kapton® polyimide was chosen as reference substrate material, was characterized regarding mechanical and electrical properties and was used as a basis for a comparison with several textile substrates. Samples were fabricated using physical vapour deposition (thermal evaporation) to deposit a thin layer of aluminium on top of Kapton and textile substrates. The measurement of electrical resistance of the thin aluminum films was carried out using the Kelvin method. To characterize the mechanical behaviour of the substrate and aluminum film, several mechanical tests were performed and results were compared between Kapton and these textile materials. The chemical composition of the textile substrates and aluminum films as well as the continuity of the films was characterized. This selection process identified the material that was closer to the behaviour of polyimide, a flexible, but non-elastic woven textile coated on both sides with PVC.