Utilize este identificador para referenciar este registo: https://hdl.handle.net/1822/1565

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Campo DCValorIdioma
dc.contributor.authorGuedes, A.-
dc.contributor.authorPinto, A. M. P.-
dc.contributor.authorVieira, M. F.-
dc.contributor.authorViana, Filomena-
dc.contributor.authorVieira, M. T.-
dc.contributor.authorRamos, A. S.-
dc.date.accessioned2005-05-12T15:10:19Z-
dc.date.available2005-05-12T15:10:19Z-
dc.date.issued2002-
dc.identifier.citation"Key engineering materials". ISSN 1013-9826. 230-232 (2002) 27-30.eng
dc.identifier.isbn0878499059por
dc.identifier.issn1013-9826-
dc.identifier.urihttps://hdl.handle.net/1822/1565-
dc.description.abstractThe joining of a gamma-TiAl alloy using Incusil-ABA as filler metal was investigated. Bonding was performed in a high vacuum furnace at 750 ºC for 10 min. The interfacial microstructure was analysed by SEM and its composition was investigated by EDS. An intense diffusion of Ti and Al to the interface and a strong reaction between the braze alloy and the base metal were observed. The interface could be divided into two distinct zones: (1) the reaction layer located near the base metal, essentially composed by Cu-Al-Ti compounds and (2) the central zone of the interface that corresponds to an (Ag) solid solution in which Cu-Al-Ti compounds are dispersed.eng
dc.language.isoengeng
dc.publisherTrans Tech Publicationseng
dc.rightsopenAccesseng
dc.subjectTiAleng
dc.subjectJoiningeng
dc.subjectBrazingeng
dc.titleMicrostructural characterisation of gamma-TiAl jointseng
dc.typeconferencePapereng
dc.peerreviewedyeseng
oaire.citationStartPage27por
oaire.citationEndPage30por
oaire.citationVolume230-2por
dc.subject.wosScience & Technologypor
sdum.journalKey Engineering Materialspor
sdum.conferencePublicationADVANCED MATERIALS FORUM Ipor
Aparece nas coleções:CIICS - Artigos em revistas de circulação internacional com arbitragem científica
DEM - Artigos em revistas de circulação internacional com arbitragem científica

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