Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/70358
Título: | Advanced electrically conductive adhesives for high complexity PCB assembly |
Autor(es): | Lopes, Paulo Estevão Caldeira Moura, Duarte Alexandre Campos Serra Freitas, D. Proença, M. Fernanda R. P. Figueiredo, H. Alves, R. Paiva, M. C. |
Data: | 2019 |
Editora: | AIP Publishing |
Revista: | AIP Conference Proceedings |
Resumo(s): | Electronic packaging, or assembly of packed electronic components on printed circuit boards, present challenges that require innovative solder pastes and electrically conductive adhesives to face the increasing complexity of PCB assembly, with denser board occupation and demanding thermal management during assembly. Our aim is to prepare carbon particle based conductive adhesives. The first step to achieve this goal was to prepare composites with epoxy resin and a variety of nano to micron scale carbon particle, produced by mixing on a three roll mill. The percolation threshold for each particle type was determined as well as the conductivity level reached after percolation. |
Tipo: | Artigo em ata de conferência |
URI: | https://hdl.handle.net/1822/70358 |
ISBN: | 9780735417830 |
DOI: | 10.1063/1.5084887 |
ISSN: | 0094-243X |
e-ISSN: | 1551-7616 |
Versão da editora: | https://aip.scitation.org/doi/abs/10.1063/1.5084887 |
Arbitragem científica: | yes |
Acesso: | Acesso aberto |
Aparece nas coleções: | IPC - Artigos em revistas científicas internacionais com arbitragem |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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AIP conf paper_2018_Bosch.pdf | 909,06 kB | Adobe PDF | Ver/Abrir |