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TitleWetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospheres
Author(s)Soares, Delfim
Gonçalves, Cristina Isabel Batista
Leitão, H
Lau, C.S.
Teixeira, J. Carlos
Ribas, José Luis
Teixeira, S. F. C. F.
Cerqueira, M. F.
Macedo, Francisco
Issue date2015
JournalJournal of Materials Science: Materials in Electronics
CitationC. Gonçalves, H. Leitão, J. C. Teixeira, L. Ribas, S. Teixeira, M. F. Cerqueira, F. Macedo, D. Soares (2015) Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospheres, Journal of Materials Science: Materials in Electronics, DOI:
Abstract(s)The wettability between solder and substrate is a very important issue in reliability of soldering process. The contact angle h is used to measure the degree of wetting. The contact angle of lead-free alloy Sn-3 % Ag-0.5 % Cu (wt%) was measured, as a function of temperature, for three different commercial surface finish substrates used in printed circuit boards (PCB): Sn, NiAu and Organic Solderability Preservative (OSP). The measurements were performed by the sessile drop method in two different atmospheres: high vacuum and inert gas. In high vacuum the results showed that on substrates of NiAu and OSP the solder started spreading suddenly at 225 C and in Sn substrate the contact angle decreases slightly with temperature. In inert gas atmosphere the results showed different behaviours: the contact angle between molten solder in OSP and NiAu substrates is sensitive to temperature; and, in Sn substrate, the contact angle does not change with temperature. The NiAu and OSP substrates showed a better degree of wettability than Sn substrate, in inert atmosphere.
AccessRestricted access (UMinho)
Appears in Collections:CAlg - Artigos em revistas internacionais / Papers in international journals
DEM - Artigos em revistas de circulação internacional com arbitragem científica

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