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|Title:||A 45° saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography|
|Author(s):||Maciel, M. J.|
Costa, C. G.
Silva, M. F.
Gonçalves, S. B.
Peixoto, A. C.
Ribeiro, António Fernando
Wolffenbuttel, R. F.
Correia, J. H.
|Keywords:||optical coherence tomography|
45° saw-dicing technology
45 degrees saw-dicing technology
|Journal:||Journal of Micromechanics and Microengineering|
|Abstract(s):||This paper reports on the development of a technology for the wafer-level fabrication of an optical Michelson interferometer, which is an essential component in a micro optoelectromechanical system (MOEMS) for a miniaturized optical coherence tomography (OCT) system. The MOEMS consists on a titanium dioxide/silicon dioxide dielectric beam splitter and chromium/gold micro-mirrors. These optical components are deposited on 45° tilted surfaces to allow the horizontal/vertical separation of the incident beam in the final microintegrated system. The fabrication process consists of 45° saw dicing of a glass substrate and the subsequent deposition of dielectric multilayers and metal layers. The 45° saw dicing is fully characterized in this paper, which also includes an analysis of the roughness. The optimum process results in surfaces with a roughness of 19.76 nm (rms). The actual saw dicing process for a high-quality final surface results as a compromise between the dicing blade’s grit size (#1200) and the cutting speed (0.3mm s−1). The proposed wafer-level fabrication allows rapid and low-cost processing, high compactness and the possibility of wafer-level alignment/ assembly with other optical micro components for OCT integrated imaging|
|Appears in Collections:||CAlg - Artigos em revistas internacionais/Papers in international journals|
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