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TitleA 45° saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography
Author(s)Maciel, M. J.
Costa, C. G.
Silva, M. F.
Gonçalves, S. B.
Peixoto, A. C.
Ribeiro, António Fernando
Wolffenbuttel, R. F.
Correia, J. H.
Keywordsoptical coherence tomography
45° saw-dicing technology
glass roughness
45 degrees saw-dicing technology
Issue date2016
PublisherIOP Publishing
JournalJournal of Micromechanics and Microengineering
Abstract(s)This paper reports on the development of a technology for the wafer-level fabrication of an optical Michelson interferometer, which is an essential component in a micro optoelectromechanical system (MOEMS) for a miniaturized optical coherence tomography (OCT) system. The MOEMS consists on a titanium dioxide/silicon dioxide dielectric beam splitter and chromium/gold micro-mirrors. These optical components are deposited on 45° tilted surfaces to allow the horizontal/vertical separation of the incident beam in the final microintegrated system. The fabrication process consists of 45° saw dicing of a glass substrate and the subsequent deposition of dielectric multilayers and metal layers. The 45° saw dicing is fully characterized in this paper, which also includes an analysis of the roughness. The optimum process results in surfaces with a roughness of 19.76 nm (rms). The actual saw dicing process for a high-quality final surface results as a compromise between the dicing blade’s grit size (#1200) and the cutting speed (0.3mm s−1). The proposed wafer-level fabrication allows rapid and low-cost processing, high compactness and the possibility of wafer-level alignment/ assembly with other optical micro components for OCT integrated imaging
AccessOpen access
Appears in Collections:CAlg - Artigos em revistas internacionais/Papers in international journals

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