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|Title:||Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospheres|
Gonçalves, Cristina Isabel Batista
Teixeira, J. Carlos
Ribas, José Luis
Teixeira, S. F. C. F.
Cerqueira, M. F.
|Journal:||Journal of Materials Science: Materials in Electronics|
|Citation:||C. Gonçalves, H. Leitão, J. C. Teixeira, L. Ribas, S. Teixeira, M. F. Cerqueira, F. Macedo, D. Soares (2015) Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmospheres, Journal of Materials Science: Materials in Electronics, DOI: http://link.springer.com/article/10.1007/s10854-015-3037-9|
|Abstract(s):||The wettability between solder and substrate is a very important issue in reliability of soldering process. The contact angle h is used to measure the degree of wetting. The contact angle of lead-free alloy Sn-3 % Ag-0.5 % Cu (wt%) was measured, as a function of temperature, for three different commercial surface finish substrates used in printed circuit boards (PCB): Sn, NiAu and Organic Solderability Preservative (OSP). The measurements were performed by the sessile drop method in two different atmospheres: high vacuum and inert gas. In high vacuum the results showed that on substrates of NiAu and OSP the solder started spreading suddenly at 225 C and in Sn substrate the contact angle decreases slightly with temperature. In inert gas atmosphere the results showed different behaviours: the contact angle between molten solder in OSP and NiAu substrates is sensitive to temperature; and, in Sn substrate, the contact angle does not change with temperature. The NiAu and OSP substrates showed a better degree of wettability than Sn substrate, in inert atmosphere.|
|Access:||Restricted access (UMinho)|
|Appears in Collections:||CAlg - Artigos em revistas internacionais/Papers in international journals|
DEM - Artigos em revistas de circulação internacional com arbitragem científica
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