Please use this identifier to cite or link to this item: http://hdl.handle.net/1822/4592

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dc.contributor.authorCorreia, J. H.-
dc.contributor.authorBartek, M.-
dc.contributor.authorWolffenbuttel, R. F.-
dc.date.accessioned2006-03-20T12:43:50Z-
dc.date.available2006-03-20T12:43:50Z-
dc.date.issued1998-
dc.identifier.citationINTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, SEMICONDUCTERS, SENSORS AND ACTUATORS, 1, Santa Clara Marriott, CA, USA, 1998 – “International Conference on Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators : proceedings”. Cambridge, MA : Computational Publications, 1998. ISBN 0-9666135-0-3. p. 563-568.eng
dc.identifier.isbn0-9666135-0-3-
dc.identifier.urihttp://hdl.handle.net/1822/4592-
dc.description.abstractThis paper reports on the use of Finite-Element-Methods (FEM) to model and simulate a non-planar composite diaphragm, which is to be used in silicon microinterferometers. Geometrical form, bending distances, deflection, stress, fatigue and flatness of a diaphragm based on a low stress silicon nitride membrane/Si frame are simulated and compared with experimental results. The ability to accurately simulate in detail the diaphragm mechanical behavior through FEM was demonstrated.eng
dc.description.sponsorshipSTW - Project DEL55.3733. TU Delft. Junta Nacional de Investigação Científica e Tecnológica - PRAXIS XXI-BD/5181/95.eng
dc.language.isoengeng
dc.rightsopenAccesseng
dc.subjectSiN membraneeng
dc.subjectFEMeng
dc.titleLoad-deflection of a low-stress SiN-membrane/Si-frame composite diaphragmeng
dc.typeconferencePapereng
dc.peerreviewedyeseng
Appears in Collections:DEI - Artigos em atas de congressos internacionais

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