Please use this identifier to cite or link to this item: http://hdl.handle.net/1822/2334

TitleStudy of the interface reactions between two lead-free solders and copper substrates
Author(s)Soares, Delfim
Vilarinho, Cândida
Barbosa, J.
Silva, Rosa
Castro, F.
KeywordsLead-free alloys
Interface reactions
Intermetallics
Issue dateMay-2004
CitationCONGRESSO IBEROAMERICANO DE METALURGIA Y MATERIALES, 8, Quito, 2004 – “IBEROMET : VIII Congresso Iberoamericano de Metalurgia y Materiales : actas”. [S.l. : s.n., 2004].
Abstract(s)Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn- Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and type of layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layer. The phases formed at the interface between the Cu substrate and a molten lead-free solder were studied, at 250 ºC, with different stage times and alloy compositions. The melting temperatures of the studied alloys, were determined by Differential Scanning Calorimetry (DSC). Identification of equilibrium phases, formed at the interface layer, and the evaluation of their chemical compositions were performed by Scanning Electron Microscopy (SEM/EDS). Results of the studied systems were compared with the interface characteristics obtained for a traditional Sn-Pb solder alloy. Different interface characteristics were obtained, namely for the alloys containing Zn.
TypeConference paper
URIhttp://hdl.handle.net/1822/2334
Peer-Reviewedyes
AccessOpen access
Appears in Collections:DEM - Publicações em actas de encontros científicos / Papers in conference proceedings

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