Please use this identifier to cite or link to this item: http://hdl.handle.net/1822/1632

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dc.contributor.authorMendes, P. M.-
dc.contributor.authorCorreia, J. H.-
dc.contributor.authorBartek, M.-
dc.contributor.authorBurghartz, J. N.-
dc.date.accessioned2005-05-17T15:52:17Z-
dc.date.available2005-05-17T15:52:17Z-
dc.date.issued2002-11-
dc.identifier.citationSAFE. Annual Workshop on Semi-conductor Advances for Future Electronics, 4, Veldhoven, 2002. "Proceedings of SAFE 2002". Veldhoven : STW, 2002. ISBN 90-73461-33-2. p. 51-54.eng
dc.identifier.isbn90-73461-33-2-
dc.identifier.urihttp://hdl.handle.net/1822/1632-
dc.description.abstractThis paper presents the design and characterization of a patch antenna built on lossy substrates compatible with integrated circuits fabrication. Two different substrates were used for antenna implementation: high-resistivity silicon (HRS) and Corning Pyrex #7740 glass. The antenna prototypes were built to operate close to the 5 GHz ISM band where applications like HIPERLAN and IEEE802.11a are standardized. They operate at a center frequency of 5.705 GHz (HRS) and 5.995 GHz (Pyrex). The studied parameters were: substrate thickness, substrate losses, oxide thickness, metal conductivity and thickness. The antenna on HRS uses an area of 8 mm2, providing a 90 MHz bandwidth and ~0.3 dBi of gain. On a glass substrate, the antenna uses 12 mm2, provides 100 MHz bandwidth and ~3 dBi of gain.eng
dc.description.sponsorshipFundação para a Ciência e Tecnologia (FCT), project (SFRH/BD/4717/2001 and POCTI/ESE/38468/2001)eng
dc.language.isoengeng
dc.publisherTechnology Foundation STWeng
dc.rightsopenAccesseng
dc.subjectPatch antennaseng
dc.subjectChip-size antennaseng
dc.subjectAntenna integrationeng
dc.titleAnalysis of chip-size antennas on lossy substrates for short-range wireless micro systemseng
dc.typeconferencePapereng
dc.peerreviewedyeseng
Appears in Collections:DEI - Artigos em atas de congressos internacionais

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