Please use this identifier to cite or link to this item: http://hdl.handle.net/1822/12418

TitleEffect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder
Author(s)Soares, Delfim
Vilarinho, Cândida
Barbosa, J.
Silva, Rosa
Castro, F.
KeywordsSolder
Interface reactions
Bismuth effect
Issue date2005
PublisherCentro Nacional de Investigaciones Metalúrgicas (CENIM)
JournalRevista de Metalurgia
CitationD. Soares, C. Vilarinho, J. Barbosa, R. Silva, M. Pinho, F. Castro - Study of the interface reactions between a nickel substrate and Sn-Zn-Al-Bi lead-free solders. Revista de Metalurgia, Vol 41 (Extra) (2005), p.208-212
Abstract(s)Because of environmental and health concerns, some alternative solder alloys, named lead-free ones, are being developed. Among them, the Sn-Zn-Al system has been studied and reveals promising properties. In this work the presence of bismuth, in the range of 0 - 8 wt%, was evaluated in what concerns to the chemical interactions between solder/substrate and the equilibrium phases present at the interface. The phases formed at the interface between the Cu substrate and a molten lead-free solder were studied with different time of stage and alloy compositions. The effect of Bi content on transformation temperatures of a Sn-9Zn-1Al base alloy was studied by Differential Scanning Calorimetry (DSC). For each alloy the solidification range was determined, which is an important characteristic regarding the application of these materials in the electronic industry. Identification of equilibrium phases and their chemical composition evaluation was performed by scanning electron microscopy (SEM/EDS). The interface thickness and chemical composition profiles were also evaluated
Typearticle
URIhttp://hdl.handle.net/1822/12418
ISSN0034-8570
Peer-Reviewedyes
AccessopenAccess
Appears in Collections:CT2M - Artigos em revistas de circulação internacional com arbitragem científica

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