| Issue Date | Title | Author(s) | Type | Access |
| Oct-2004 | Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives | Bartek, M.; Polyakov, A.; Sinaga, S. M., et al. | Conference paper | Open access |
| 20-Jan-2005 | High-resistivity polycrystalline silicon as RF substrate in wafer-level packaging | Polyakov, A.; Sinaga, S. M.; Mendes, P. M., et al. | Article | Open access |
| May-2003 | Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages | Polyakov, A.; Mendes, P. M.; Sinaga, S. M., et al. | Conference paper | Open access |
| Sep-2004 | Wafer-level chip-scale packaging for low-end RF products | Bartek, M.; Zilmer, G.; Teomin, D., et al. | Conference paper | Open access |
| Jun-2004 | Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technology | Mendes, P. M.; Sinaga, S. M.; Polyakov, A., et al. | Conference paper | Open access |
| 14-Nov-2004 | Wafer-level packaging fo RF applications : using high resistivity polycrystalline silicon substrate technology | Polyakov, A.; Sinaga, S. M.; Mendes, P. M., et al. | Conference paper | Open access |
